AS4C512M8D4-83BIN - Alliance Memory

AS4C512M8D4-83BIN Details

• Manufacturer Part Number:

  AS4C512M8D4-83BIN

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  FBGA-78

• Country Of Origin:

  Taiwan

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.36

• Factory Lead Time:

  8 Weeks

• Date Of Intro:

  2019-09-09

• Manufacturer:

  Alliance Memory Inc

• YTEOL:

  5.1

• Access Mode:

  MULTI BANK PAGE BURST

• Additional Feature:

  AUTO/SELF REFRESH

• Clock Frequency-Max (fCLK):

  1200 MHz

• I/O Type:

  COMMON

• Interleaved Burst Length:

  8

• JESD-30 Code:

  R-PBGA-B78

• Length:

  10.6 mm

• Memory Density:

  4294967296 bit

• Memory IC Type:

  DDR4 DRAM

• Memory Width:

  8

• Number of Functions:

  1

• Number of Ports:

  1

• Number of Terminals:

  78

• Number of Words:

  536870912 words

• Number of Words Code:

  512000000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  95 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  512MX8

• Output Characteristics:

  3-STATE

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TFBGA

• Package Equivalence Code:

  BGA78,9X13,32

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, THIN PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  NOT SPECIFIED

• Refresh Cycles:

  8192

• Seated Height-Max:

  1.2 mm

• Self Refresh:

  YES

• Sequential Burst Length:

  8

• Standby Current-Max:

  0.04 A

• Supply Current-Max:

  0.187 mA

• Supply Voltage-Max (Vsup):

  1.26 V

• Supply Voltage-Min (Vsup):

  1.14 V

• Supply Voltage-Nom (Vsup):

  1.2 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  NOT SPECIFIED

• Width:

  7.5 mm