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AS4C64M16MD1A-5BIN - Alliance Memory

Description: DRAM LPDDR1, 1G, 64M x 16, 1.8V, 200MHz, 60ball FBGA, (A-die), Industrial Temp - Tray

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PCB Footprints
AS4C64M16MD1A-5BIN - Alliance Memory PCB footprint - BGA - BGA - FBGA-60.
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3D Models
AS4C64M16MD1A-5BIN - Alliance Memory  - 3D model - BGA - FBGA-60.
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AS4C64M16MD1A-5BIN Details

  • Manufacturer Part Number:

    AS4C64M16MD1A-5BIN

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    FBGA-60

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.32

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Alliance Memory Inc

  • YTEOL:

    0

AS4C64M16MD1A-5BIN Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the AS4C64M16MD1A-5BIN is 0°C to 70°C (commercial grade) and -40°C to 85°C (industrial grade).
  • The AS4C64M16MD1A-5BIN requires a refresh cycle every 64ms (tREF) to maintain data integrity. You can use a refresh counter to keep track of the refresh cycles and issue an AUTO REFRESH command (CBR) to refresh the entire memory array.
  • The AS4C64M16MD1A-5BIN supports a maximum clock frequency of 166MHz.
  • During power-up, the VDD and VDDQ pins should be powered up simultaneously, followed by the clock signal. During power-down, the clock signal should be stopped, followed by the VDD and VDDQ pins being powered down simultaneously.
  • The AS4C64M16MD1A-5BIN has a latency of 5 clock cycles (CL5).

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AS4C64M16MD1A-5BIN Overview

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