8 X 8 MM, 1.20 MM HEIGHT, HALOGEN FREE AND ROHS COMPLIANT, TFBGA-54
Country Of Origin:
Taiwan
ECCN Code:
EAR99
HTS Code:
8542.32.00.02
Factory Lead Time:
6 Weeks
Manufacturer:
Alliance Memory Inc
YTEOL:
4
Access Mode:
FOUR BANK PAGE BURST
Access Time-Max:
5.4 ns
Additional Feature:
AUTO/SELF REFRESH
JESD-30 Code:
S-PBGA-B54
Length:
8 mm
Memory Density:
134217728 bit
Memory IC Type:
SYNCHRONOUS DRAM
Memory Width:
16
Moisture Sensitivity Level:
3
Number of Functions:
1
Number of Ports:
1
Number of Terminals:
54
Number of Words:
8388608 words
Number of Words Code:
8000000
Operating Mode:
SYNCHRONOUS
Operating Temperature-Max:
70 °C
Organization:
8MX16
Package Body Material:
PLASTIC/EPOXY
Package Code:
TFBGA
Package Shape:
SQUARE
Package Style:
GRID ARRAY, THIN PROFILE, FINE PITCH
Seated Height-Max:
1.2 mm
Self Refresh:
YES
Supply Voltage-Max (Vsup):
3.6 V
Supply Voltage-Min (Vsup):
3 V
Supply Voltage-Nom (Vsup):
3.3 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
COMMERCIAL
Terminal Form:
BALL
Terminal Pitch:
0.8 mm
Terminal Position:
BOTTOM
Width:
8 mm
AS4C8M16SA-7BCN Frequently Asked Questions (FAQs)
The AS4C8M16SA-7BCN has an operating temperature range of 0°C to 70°C.
The AS4C8M16SA-7BCN requires a refresh cycle every 64ms, with a minimum of 8192 refreshes within an 64ms interval.
The AS4C8M16SA-7BCN has a maximum clock frequency of 143MHz.
After power-up, the AS4C8M16SA-7BCN requires a minimum of 200us delay before applying clock signals, followed by a minimum of 8 clock cycles of NOP commands, and then a MODE REGISTER SET command to initialize the device.
The AS4C8M16SA-7BCN has a latency of 7 clock cycles (CL7).
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AS4C8M16SA-7BCN Overview
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