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AS4C8M32SA-6BIN - Alliance Memory

Description: DRAM 256Mb, 3.3V, 143Mhz 8M x 32 SDRAM

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PCB Footprints
AS4C8M32SA-6BIN - Alliance Memory PCB footprint - BGA - BGA - 90-ball FBGA .
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3D Models
AS4C8M32SA-6BIN - Alliance Memory  - 3D model - BGA - 90-ball FBGA .
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AS4C8M32SA-6BIN Details

  • Manufacturer Part Number:

    AS4C8M32SA-6BIN

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FBGA-90

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.24

  • Factory Lead Time:

    16 Weeks

  • Date Of Intro:

    2016-11-16

  • Manufacturer:

    Alliance Memory Inc

  • YTEOL:

    4

  • Access Mode:

    FOUR BANK PAGE BURST

  • Access Time-Max:

    5 ns

  • Additional Feature:

    AUTO/SELF REFRESH

  • JESD-30 Code:

    R-PBGA-B90

  • JESD-609 Code:

    e1

  • Length:

    13 mm

  • Memory Density:

    268435456 bit

  • Memory IC Type:

    SYNCHRONOUS DRAM

  • Memory Width:

    32

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    90

  • Number of Words:

    8388608 words

  • Number of Words Code:

    8000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    8MX32

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Seated Height-Max:

    1.2 mm

  • Self Refresh:

    YES

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    8 mm

AS4C8M32SA-6BIN Frequently Asked Questions (FAQs)

  • The AS4C8M32SA-6BIN can operate in a temperature range of 0°C to 70°C, with an extended temperature range of -40°C to 85°C available for industrial grade devices.
  • The SDRAM requires a power-on reset sequence, which involves applying a clock signal, then asserting the chip select (CS) and clock enable (CKE) signals low, followed by a delay, and finally de-asserting the CS and CKE signals.
  • The minimum clock cycle time for the AS4C8M32SA-6BIN is 6ns, which corresponds to a maximum clock frequency of 166.7 MHz.
  • The AS4C8M32SA-6BIN requires periodic refresh cycles to maintain data integrity. The refresh interval is 64ms, and a minimum of 8192 refresh cycles are required every 64ms.
  • The AS4C8M32SA-6BIN has a maximum data transfer rate of 1333 MB/s, assuming a clock frequency of 166.7 MHz and a data bus width of 32 bits.

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AS4C8M32SA-6BIN Overview

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Part Image AS4C8M32SA-6BCN Alliance Memory Inc

Synchronous DRAM, 8MX32, 5ns, CMOS, PBGA90