- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for AX5051-1-TW30
- Part Number AX5051-1-TW30
- Manufacturer onsemi
- Pin Count 29
- Part Category Integrated Circuit
- Package Category Quad Flat No-Lead
- Footprint Name Quad Flat No-Lead - AX5051-1-TW30
- Released Date Jun 4, 2019
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
AX5051-1-TW30 Details
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Manufacturer Part Number:
AX5051-1-TW30
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Brand Name:
ON Semiconductor
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Pbfree Code:
Yes
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Rohs Code:
Yes
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Part Life Cycle Code:
Obsolete
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Manufacturer Package Code:
485EF
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Country Of Origin:
Thailand
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HTS Code:
8542.39.00.01
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Factory Lead Time:
4 Weeks
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Date Of Intro:
2020-09-15
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Manufacturer:
onsemi
AX5051-1-TW30 Frequently Asked Questions (FAQs)
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A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the thermal pad to connect to the copper area.
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Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Also, consider the power dissipation and thermal resistance of the package when designing the system.
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A 10uF to 22uF X5R or X7R ceramic capacitor is recommended for input decoupling. The capacitor should be placed as close to the VIN pin as possible.
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Yes, but ensure that the device is properly heatsinked and the thermal design is adequate to handle the increased power dissipation. Also, consider the current limit and power rating of the device.
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The output voltage can be adjusted by using an external resistor divider network between the VOUT pin and the ADJ pin. The datasheet provides a formula to calculate the required resistor values.
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AX5051-1-TW30 Overview
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