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BAW56LT3G - onsemi

Description: Pb-Free Packages are Available; S & SSV1 Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ101 Qualified and PPAP Capable

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PCB Footprints
BAW56LT3G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08
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3D Models
BAW56LT3G - onsemi  - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08
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BAW56LT3G Details

  • Manufacturer Part Number:

    BAW56LT3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Manufacturer:

    onsemi

  • YTEOL:

    6.1

  • Application:

    GENERAL PURPOSE

  • Configuration:

    COMMON ANODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.715 V

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    4 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.225 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    70 V

  • Reverse Recovery Time-Max:

    0.006 µs

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

BAW56LT3G Frequently Asked Questions (FAQs)

  • A good PCB layout for BAW56LT3G involves keeping the leads as short as possible, using a ground plane, and minimizing the distance between the device and the antenna. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure reliability in high-temperature applications, it's essential to follow the recommended derating curves, ensure good thermal management, and consider using a heat sink or thermal interface material. Additionally, consider using a thermally conductive adhesive to attach the device to the PCB.
  • The BAW56LT3G has an internal ESD protection diode, but it's still important to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is handled in a static-safe environment.
  • While the BAW56LT3G is primarily designed for linear applications, it can be used in switching applications with some precautions. Ensure that the device is operated within its safe operating area, and consider using a snubber circuit to reduce voltage spikes.
  • To troubleshoot issues with the BAW56LT3G, start by verifying the device's pinout and ensuring that it's properly soldered to the PCB. Check the voltage and current ratings, and use a scope to monitor the device's behavior. Consult the datasheet and application notes for guidance on specific issues.

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BAW56LT3G Overview

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