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BC32716BU - onsemi

Description: Obsolete - PNP Bipolar Transistor

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PCB Footprints
BC32716BU - onsemi PCB footprint - Other - Other - TO−92 3 4.825x4.76 CASE 135AN ISSUE O_2024-4
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3D Models
BC32716BU - onsemi  - 3D model - Other - TO−92 3 4.825x4.76 CASE 135AN ISSUE O_2024-4
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BC32716BU Details

  • Manufacturer Part Number:

    BC32716BU

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-92-3

  • Package Description:

    LEAD FREE, TO-92, 3 PIN

  • Manufacturer Package Code:

    135AN

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Collector Current-Max (IC):

    0.8 A

  • Collector-Emitter Voltage-Max:

    45 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    60

  • JEDEC-95 Code:

    TO-92

  • JESD-30 Code:

    O-PBCY-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    CYLINDRICAL

  • Polarity/Channel Type:

    PNP

  • Power Dissipation-Max (Abs):

    0.625 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    BOTTOM

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    100 MHz

BC32716BU Frequently Asked Questions (FAQs)

  • A good PCB layout for the BC32716BU should include a solid ground plane, wide power traces, and a thermal relief pattern under the device to facilitate heat dissipation. A minimum of 2 oz copper thickness is recommended.
  • To ensure reliable operation in high-temperature environments, ensure proper heat sinking, use a thermally conductive interface material, and follow the recommended PCB layout guidelines. Additionally, consider derating the device's power handling capabilities according to the temperature derating curve provided in the datasheet.
  • The recommended soldering conditions for the BC32716BU are: peak temperature of 260°C, soldering time of 10-30 seconds, and a soldering iron temperature of 350°C. It's essential to follow these conditions to prevent damage to the device.
  • To protect the BC32716BU from ESD, handle the device in an ESD-controlled environment, use ESD-protective packaging, and ensure that all equipment and personnel are properly grounded. Additionally, consider using ESD-protection devices or circuits in the system design.
  • The limited availability of spare gates in the BC32716BU may impact the design's flexibility and scalability. Engineers should carefully plan their design to minimize the need for spare gates and consider using alternative devices or architectures if spare gates are essential.

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BC32716BU Overview

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BC32716BU Alternates

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Image Part Number Model
Part Image BC327-16 Secos Corporation

Small Signal Bipolar Transistor, 0.8A I(C), 45V V(BR)CEO, 1-Element, PNP, Silicon, TO-92

Part Image BC327-16 Vishay Intertechnologies

Small Signal Bipolar Transistor, 0.8A I(C), 1-Element, PNP

Part Image BC327-16 WEITRON INTERNATIONAL CO., LTD.

Small Signal Bipolar Transistor

Part Image BC32716TF Fairchild Semiconductor Corporation

Small Signal Bipolar Transistor, 0.8A I(C), 45V V(BR)CEO, 1-Element, PNP, Silicon, TO-92

Part Image BC327-16-AMMO NXP Semiconductors

Small Signal Bipolar Transistor, 0.5A I(C), 45V V(BR)CEO, 1-Element, PNP, Silicon, TO-92

For a full list of alternate parts for BC32716BU, check out Findchips.com