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BC818-40LT1G - onsemi

Description: Bipolar (BJT) Transistor NPN 25 V 500 mA 100MHz 225 mW Surface Mount SOT-23-3 (TO-236)

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BC818-40LT1G - onsemi - PCB symbol
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PCB Footprints
BC818-40LT1G - onsemi PCB footprint - Other - Other - SOT−23 (TO−236) 2.90x1.30x1.00 1.90P CASE 318 ISSUE AU
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BC818-40LT1G - onsemi - 3D model - Other - SOT−23 (TO−236) 2.90x1.30x1.00 1.90P CASE 318 ISSUE AU
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BC818-40LT1G Details

  • Manufacturer Part Number:

    BC818-40LT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Collector Current-Max (IC):

    0.5 A

  • Collector-Base Capacitance-Max:

    10 pF

  • Collector-Emitter Voltage-Max:

    25 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    40

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.3 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    100 MHz

  • VCEsat-Max:

    0.7 V

BC818-40LT1G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the thermal pad to connect to a solid copper plane on the inner layers.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Implement a thermal management system, such as a heat sink or fan, to keep the junction temperature below 125°C. Monitor the device's thermal resistance (RθJA) and adjust the system design accordingly.
  • The BC818-40LT1G has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that all equipment is properly grounded. Avoid touching the device's pins or handling the device in a way that could generate static electricity.
  • Yes, the BC818-40LT1G is qualified for automotive and high-reliability applications. It meets the requirements of AEC-Q101, a standard for automotive-grade discrete semiconductors. However, ensure that your specific application meets the required qualification and testing standards.
  • Start by verifying the device's pinout and connections. Check for proper voltage supply, correct polarity, and ensure that the device is not overheating. Use a multimeter to measure voltage and current at the device's pins. If issues persist, consult the datasheet and application notes or contact onsemi's technical support.

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BC818-40LT1G Overview

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BC818-40LT1G Alternates

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Part Image BC818-40LT1 onsemi

Small Signal Bipolar Transistor, 0.5A I(C), 25V V(BR)CEO, 1-Element, NPN, Silicon, TO-236AB