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BCR133 - Infineon

Description: Infineon, BCR133 NPN Digital Transistor, 100 mA 50 V 10 kΩ, Ratio Of 1, 3-Pin SOT-23

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Symbol
BCR133 - Infineon - PCB symbol
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PCB Footprints
BCR133 - Infineon PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT23_BCR133
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3D Models
BCR133 - Infineon - 3D model - SOT23 (3-Pin) - SOT23_BCR133
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BCR133 Details

  • Manufacturer Part Number:

    BCR133

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    3.43

  • Additional Feature:

    BUILT-IN BIAS RESISTOR RATIO IS 1

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SINGLE WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    30

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    NPN

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    130 MHz

BCR133 Frequently Asked Questions (FAQs)

  • Infineon recommends a thermal pad on the bottom side of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Infineon recommends following the thermal design guidelines, using a heat sink if necessary, and ensuring good airflow around the device. Additionally, the device should be operated within the specified temperature range and derating should be applied for high-temperature operation.
  • The maximum allowed voltage on the input pins is the supply voltage (VCC) + 0.5V. Exceeding this voltage may damage the device.
  • Infineon recommends following standard ESD handling procedures, such as using ESD-protective packaging, wrist straps, and mats. The device should be handled in a static-protected environment, and assembly should be done using ESD-protected tools and equipment.
  • Infineon recommends a soldering profile with a peak temperature of 260°C, a dwell time above 217°C of 30-60 seconds, and a total process time of 60-120 seconds. The device should be soldered using a lead-free soldering process.

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BCR133 Overview

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For a full list of alternate parts for BCR133, check out Findchips.com