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BCV46E6327HTSA1 - Infineon

Description: Darlington Transistors AF Trans Darlington PNP 60V 0.5A

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PCB Footprints
BCV46E6327HTSA1 - Infineon PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT23
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3D Models
BCV46E6327HTSA1 - Infineon  - 3D model - SOT23 (3-Pin) - SOT23
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BCV46E6327HTSA1 Details

  • Manufacturer Part Number:

    BCV46E6327HTSA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Country Of Origin:

    Austria, Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    1

  • Collector Current-Max (IC):

    0.5 A

  • Collector-Emitter Voltage-Max:

    60 V

  • Configuration:

    DARLINGTON

  • DC Current Gain-Min (hFE):

    2000

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    PNP

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    200 MHz

BCV46E6327HTSA1 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure the device is operated within the specified junction temperature range (TJ) of -40°C to 150°C.
  • Use a multi-layer PCB with a solid ground plane, and ensure that high-frequency signals are routed away from the device. Implement a shielded enclosure and consider using EMI filters or chokes on input/output lines.
  • Choose capacitors with a low equivalent series resistance (ESR) and a high ripple current rating. Ensure the capacitors are rated for the maximum input voltage and meet the device's recommended capacitance value.
  • Implement a robust PCB design with a solid ground plane, use shielded cables and connectors, and ensure that the device is operated within the specified frequency range. Consider using EMI filters or chokes on input/output lines.

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BCV46E6327HTSA1 Overview

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