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BCV61CE6327HTSA1 - Infineon

Description: Dual Transistor BJT NPN 30V 0.1A SOT143

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BCV61CE6327HTSA1 - Infineon - PCB symbol
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PCB Footprints
BCV61CE6327HTSA1 - Infineon PCB footprint - Other - Other - BCV61CE6327HTSA1-1
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BCV61CE6327HTSA1 - Infineon - 3D model - Other - BCV61CE6327HTSA1-1
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BCV61CE6327HTSA1 Details

  • Manufacturer Part Number:

    BCV61CE6327HTSA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    ROHS COMPLIANT PACKAGE-4

  • Country Of Origin:

    Austria, Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    1

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    30 V

  • Configuration:

    CURRENT MIRROR

  • DC Current Gain-Min (hFE):

    420

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    4

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    NPN

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    250 MHz

BCV61CE6327HTSA1 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to ensure efficient heat dissipation.
  • Use a shielded enclosure, keep the device away from antennas and high-frequency sources, and ensure proper grounding and decoupling of the device. Follow Infineon's EMC guidelines for more information.
  • The maximum allowed voltage on the input pins is 5.5V, but it's recommended to keep it below 5V to ensure reliable operation and prevent damage to the device.
  • Store the device in its original packaging or an equivalent ESD-protective package. Avoid bending, flexing, or exposing the device to extreme temperatures, humidity, or physical stress.
  • Follow the Infineon-recommended soldering profile: peak temperature 260°C, time above 217°C 60-90 seconds, and a maximum of 3 reflows. Use a solder with a melting point above 217°C.

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BCV61CE6327HTSA1 Overview

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