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BCW68GLT3G - onsemi

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Symbol
BCW68GLT3G - onsemi - PCB symbol
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PCB Footprints
BCW68GLT3G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08
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3D Models
BCW68GLT3G - onsemi - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08
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BCW68GLT3G Details

  • Manufacturer Part Number:

    BCW68GLT3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 2.90x1.30x1.00, 1.90P

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Collector Current-Max (IC):

    0.8 A

  • Collector-Emitter Voltage-Max:

    45 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    60

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    PNP

  • Power Dissipation-Max (Abs):

    0.3 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    100 MHz

BCW68GLT3G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor the device's junction temperature (Tj) and ensure it stays within the recommended operating range.
  • Use a multi-layer PCB with a solid ground plane, keep high-frequency traces short and away from the device, and use shielding or a Faraday cage if necessary. Ensure proper decoupling and filtering of power supplies.
  • Use a low-ESR capacitor for decoupling, minimize lead inductance, and ensure a low-impedance power supply. Optimize the PCB layout for minimal parasitic inductance and capacitance.
  • Use a soldering iron with a temperature range of 250°C to 260°C, and a solder with a melting point above 217°C. For rework, use a hot air rework station with a temperature range of 200°C to 250°C.

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BCW68GLT3G Overview

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