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BCX71JLT1G - onsemi

Description: General Purpose Transistor

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BCX71JLT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - BCX71JLT1G
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BCX71JLT1G - onsemi  - 3D model - SOT23 (3-Pin) - BCX71JLT1G
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BCX71JLT1G Details

  • Manufacturer Part Number:

    BCX71JLT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    45 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    100

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    PNP

  • Power Dissipation-Max (Abs):

    0.35 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    800 ns

  • Turn-on Time-Max (ton):

    150 ns

BCX71JLT1G Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to use a thermal pad on the bottom of the package, connected to a large copper area on the PCB. This helps to dissipate heat efficiently. Additionally, using thermal vias and a solid copper ground plane can further improve thermal performance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range (up to 150°C) and consider the device's power dissipation. Implementing thermal management techniques, such as heat sinks or fans, can help maintain a safe operating temperature. Additionally, ensure that the device is properly soldered and that the PCB is designed to withstand high temperatures.
  • To prevent electrostatic discharge (ESD) damage, it's recommended to follow standard ESD handling procedures during assembly and storage. Use ESD-protective packaging, wrist straps, and mats. During PCB design, consider adding ESD protection diodes or resistors to sensitive pins. Additionally, ensure that the device is powered down during handling and assembly.
  • The BCX71JLT1G is an automotive-qualified device, making it suitable for high-reliability applications. However, it's essential to follow the recommended operating conditions, and ensure that the device is properly qualified and validated for the specific application. Consult with onsemi's application notes and reliability reports for more information.
  • To troubleshoot issues with the BCX71JLT1G, start by reviewing the datasheet and application notes to ensure that the device is being used within its recommended operating conditions. Check for proper PCB design, layout, and assembly. Use oscilloscopes or logic analyzers to monitor the device's signals and identify potential issues. Consult with onsemi's technical support or application engineers for further assistance.

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BCX71JLT1G Overview

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Part Image BCX71J-T Nexperia

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Part Image BCX71J STMicroelectronics

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Part Image BCX71JTR Samsung Semiconductor

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