SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH
Qualification Status:
Not Qualified
Seated Height-Max:
1 mm
Supply Current-Max:
50 mA
Supply Voltage-Max (Vsup):
16.5 V
Supply Voltage-Min (Vsup):
10 V
Surface Mount:
YES
Technology:
BCDMOS
Temperature Grade:
INDUSTRIAL
Terminal Form:
GULL WING
Terminal Pitch:
0.8 mm
Terminal Position:
DUAL
Width:
7.5 mm
BD5426EFS-E2 Frequently Asked Questions (FAQs)
ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a dedicated heat sink.
To ensure stable operation with a high-ESR output capacitor, ROHM recommends adding a 1nF to 10nF ceramic capacitor in parallel with the output capacitor to reduce the overall ESR. Additionally, the output capacitor should be placed close to the IC to minimize parasitic inductance.
The maximum allowed voltage on the EN pin is 6V, which is the same as the maximum rating for the VCC pin. Applying a voltage higher than 6V on the EN pin can cause damage to the IC.
The BD5426EFS-E2 is rated for operation up to 105°C, but ROHM recommends derating the output current and voltage to ensure reliable operation. Consult the datasheet for specific derating guidelines and consider using a heat sink or thermal management solution to maintain a safe operating temperature.
To troubleshoot oscillations or instability issues, check the PCB layout for parasitic inductance and capacitance, ensure proper decoupling of the input and output capacitors, and verify that the output capacitor meets the recommended specifications. Also, check for voltage drops on the input and output lines, and ensure that the IC is properly soldered and connected.
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BD5426EFS-E2 Overview
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