SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Packing Method:
TR
Seated Height-Max:
1 mm
Supply Current-Max (Isup):
5 mA
Supply Voltage-Max (Vsup):
33 V
Supply Voltage-Min (Vsup):
8 V
Supply Voltage-Nom (Vsup):
30 V
Surface Mount:
YES
Technology:
BIPOLAR
Temperature Grade:
OTHER
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Width:
4.4 mm
BD63401EFV-E2 Frequently Asked Questions (FAQs)
ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a dedicated heat sink.
To ensure stable operation with a high-capacitance output capacitor, ROHM recommends adding a 1-10nF ceramic capacitor in parallel with the output capacitor to reduce the equivalent series resistance (ESR) and prevent oscillation.
The maximum allowed voltage on the EN pin is 6V, which is the absolute maximum rating. However, for normal operation, ROHM recommends keeping the EN pin voltage between 0V and 5.5V to ensure proper operation and prevent damage to the device.
The BD63401EFV-E2 is rated for operation up to 105°C, but ROHM recommends derating the output current and voltage according to the temperature derating curve provided in the datasheet to ensure reliable operation and prevent overheating.
To troubleshoot oscillation or instability issues, ROHM recommends checking the PCB layout for proper thermal design, ensuring the output capacitor is properly sized and placed, and verifying that the input voltage is within the recommended range. Additionally, checking for noise on the input and output lines and ensuring proper decoupling can help resolve the issue.
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BD63401EFV-E2 Overview
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