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BF256A - onsemi

Description: Obsolete - JFET N-Channel 30V TO-92

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PCB Footprints
BF256A - onsemi PCB footprint - Other - Other - TO–92 (TO–226) CASE 29–11 ISSUE AL
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3D Models
BF256A - onsemi  - 3D model - Other - TO–92 (TO–226) CASE 29–11 ISSUE AL
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BF256A Details

  • Manufacturer Part Number:

    BF256A

  • Brand Name:

    onsemi

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-92 (TO-226) 5.33mm Body Height

  • Package Description:

    CASE 29, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    29-11

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Configuration:

    SINGLE

  • DS Breakdown Voltage-Min:

    30 V

  • FET Technology:

    JUNCTION

  • Highest Frequency Band:

    ULTRA HIGH FREQUENCY BAND

  • JEDEC-95 Code:

    TO-92

  • JESD-30 Code:

    O-PBCY-T3

  • JESD-609 Code:

    e0

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    DEPLETION MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    CYLINDRICAL

  • Peak Reflow Temperature (Cel):

    235

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    0.3 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    BOTTOM

  • Transistor Element Material:

    SILICON

BF256A Frequently Asked Questions (FAQs)

  • The maximum SOA for the BF256A is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal resistance and maximum junction temperature. As a general guideline, the SOA is typically limited by the device's thermal capabilities, and it's recommended to keep the device within the specified thermal limits to ensure reliable operation.
  • To ensure proper biasing, follow the recommended operating conditions outlined in the datasheet, including the base-emitter voltage (VBE) and collector-emitter voltage (VCE). Additionally, consider the device's current gain (β) and ensure the base current is sufficient to maintain the desired collector current. It's also important to consider the device's thermal limitations and ensure adequate heat sinking.
  • For optimal thermal performance, it's recommended to use a PCB layout that minimizes thermal resistance and ensures good heat dissipation. This can be achieved by using a thermal pad or heat sink, and ensuring good airflow around the device. Additionally, consider using thermal vias and thermal layers in the PCB to improve heat dissipation. Consult the datasheet and application notes for specific guidance on PCB layout and thermal management.
  • To ensure ESD protection for the BF256A, follow proper handling and storage procedures to prevent electrostatic discharge. Use ESD-safe materials and equipment, and consider implementing ESD protection circuits or devices in the design. Additionally, ensure the device is properly grounded and consider using ESD protection diodes or resistors in the circuit.
  • The reliability and lifespan of the BF256A depend on various factors, including operating conditions, environmental factors, and manufacturing quality. Consult the datasheet and reliability reports for specific information on the device's expected lifespan and reliability. In general, the BF256A is designed to meet industry-standard reliability requirements, but it's essential to follow proper design and manufacturing practices to ensure optimal performance and lifespan.

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BF256A Overview

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Part Image BF256A NXP Semiconductors

RF Small Signal Field-Effect Transistor, 1-Element, Ultra High Frequency Band, Silicon, N-Channel, Junction FET, TO-92