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BF423ZL1G - onsemi

Description: Obsolete - High Voltage PNP Bipolar Transistor

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BF423ZL1G - onsemi PCB footprint - Other - Other - BF423ZL1G-6
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3D Models
BF423ZL1G - onsemi  - 3D model - Other - BF423ZL1G-6
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BF423ZL1G Details

  • Manufacturer Part Number:

    BF423ZL1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-92 (TO-226) 5.33mm Body Height

  • Package Description:

    LEAD FREE, CASE 029-11, TO-226AA, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    29-11

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    EUROPEAN PART NUMBER

  • Collector Current-Max (IC):

    0.05 A

  • Collector-Emitter Voltage-Max:

    250 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    50

  • JEDEC-95 Code:

    TO-92

  • JESD-30 Code:

    O-PBCY-T3

  • JESD-609 Code:

    e1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    CYLINDRICAL

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    PNP

  • Power Dissipation-Max (Abs):

    0.83 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    BOTTOM

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    60 MHz

BF423ZL1G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor the device's junction temperature and adjust the system design accordingly.
  • Use a shielded enclosure, ensure proper grounding, and implement EMI filters on the input and output lines. Additionally, minimize loop areas and use twisted pairs for signal lines.
  • Consult the application notes and reference designs provided by onsemi. Perform thorough simulations and testing to optimize the device's performance for your specific use case.
  • Follow the recommended soldering profile and assembly guidelines provided by onsemi. Ensure proper cleaning and handling of the device to prevent damage.

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BF423ZL1G Overview

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BF423ZL1G Alternates

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Part Image BF423 Transys Electronics Limited

Small Signal Bipolar Transistor, 0.5A I(C), 250V V(BR)CEO, 1-Element, PNP, Silicon, TO-92

Part Image BF423 TDK Micronas GmbH

Small Signal Bipolar Transistor, 250V V(BR)CEO, 1-Element, PNP, Silicon, TO-92

Part Image BF423-T/R NXP Semiconductors

Small Signal Bipolar Transistor, 0.05A I(C), 250V V(BR)CEO, 1-Element, PNP, Silicon, TO-92

Part Image BF423,116 NXP Semiconductors

Small Signal Bipolar Transistor, 0.05A I(C), 250V V(BR)CEO, 1-Element, PNP, Silicon, TO-92

Part Image BF423 Toshiba America Electronic Components

Small Signal Bipolar Transistor, 0.05A I(C), 250V V(BR)CEO, 1-Element, PNP, Silicon, TO-92

For a full list of alternate parts for BF423ZL1G, check out Findchips.com