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- Stock & Prices $ Price & Stock for BFC237052332
- Part Number BFC237052332
- Manufacturer Vishay
- Pin Count 2
- Part Category Capacitor
- Last Modified Date Jan 9, 2024 7:55 AM UTC
- Pinout / Pin List Click Here (Member Only)
BFC237052332 Details
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Manufacturer Part Number:
BFC237052332
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
RADIAL LEADED
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Reach Compliance Code:
Compliant
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ECCN Code:
EAR99
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HTS Code:
8532.25.00.70
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Factory Lead Time:
10 Weeks
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
6.82
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Capacitance:
0.0033 µF
BFC237052332 Frequently Asked Questions (FAQs)
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A symmetrical layout with a central grounding point is recommended to minimize electromagnetic interference (EMI) and ensure optimal performance. Additionally, keeping the component away from high-frequency signals and using a solid ground plane can help reduce noise and radiation.
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The BFC237052332 has a high power dissipation rating, so it's essential to ensure proper thermal management. This can be achieved by using a heat sink, thermal interface material, and a well-designed PCB layout that allows for good airflow. The component's thermal resistance (Rth) should also be considered when designing the system.
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The recommended soldering conditions for the BFC237052332 are a peak temperature of 260°C (500°F) for a maximum of 10 seconds, with a soldering iron temperature of 350°C (662°F). It's also essential to use a solder with a melting point above 217°C (423°F) to ensure reliable connections.
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To ensure the component's reliability in high-vibration environments, it's recommended to use a secure mounting method, such as screwing or adhesive bonding, and to follow the manufacturer's recommended torque values. Additionally, the PCB should be designed to minimize flexure and stress on the component.
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The BFC237052332 is sensitive to electrostatic discharge (ESD), so it's essential to handle the component with care. ESD protection measures should be taken during storage, handling, and assembly, such as using ESD-safe packaging, wrist straps, and mats. The component should also be assembled in an ESD-controlled environment.
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BFC237052332 Overview
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