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BFR30LT1G - onsemi

Description: Obsolete - Small Signal JFET

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Symbol
BFR30LT1G - onsemi - PCB symbol
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PCB Footprints
BFR30LT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-234
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3D Models
BFR30LT1G - onsemi - 3D model - SOT23 (3-Pin) - SOT-234
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BFR30LT1G Details

  • Manufacturer Part Number:

    BFR30LT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Configuration:

    SINGLE

  • DS Breakdown Voltage-Min:

    25 V

  • FET Technology:

    JUNCTION

  • Feedback Cap-Max (Crss):

    1.5 pF

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    DEPLETION MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    0.3 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

BFR30LT1G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the thermal pad to connect to a solid copper plane on the opposite side of the PCB.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Implement a thermal management system, such as a heat sink or fan, to keep the junction temperature below 125°C. Monitor the device's thermal resistance (RθJA) and ensure it is within the specified range.
  • The BFR30LT1G has an integrated ESD protection diode, but it is still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the PCB is properly grounded. Avoid touching the device pins or handling the device in a way that could generate static electricity.
  • Yes, the BFR30LT1G is qualified for automotive and high-reliability applications. It meets the AEC-Q101 qualification standard and is manufactured using a robust process that ensures high reliability. However, it is essential to follow the recommended operating conditions and design guidelines to ensure the device operates within its specified parameters.
  • Start by verifying that the device is properly soldered and that the PCB layout meets the recommended guidelines. Check the device's operating conditions, such as voltage and current, to ensure they are within the specified range. Use a thermal imaging camera to monitor the device's temperature and identify potential hotspots. If issues persist, consult the datasheet and application notes or contact onsemi's technical support team.

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BFR30LT1G Overview

Use the download button to access the BFR30LT1G schematic symbol, PCB footprint, and 3D model.
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