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BFT46 - NXP

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BFT46 - NXP PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - 3 lead sot-23
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3D Models
BFT46 - NXP  - 3D model - SOT23 (3-Pin) - 3 lead sot-23
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BFT46 Details

  • Manufacturer Part Number:

    BFT46

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-23

  • Package Description:

    PLASTIC PACKAGE-3

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Configuration:

    SINGLE

  • DS Breakdown Voltage-Min:

    25 V

  • Drain Current-Max (ID):

    0.01 A

  • FET Technology:

    JUNCTION

  • Feedback Cap-Max (Crss):

    1.5 pF

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    DEPLETION MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    0.25 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

BFT46 Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the BFT46 is 500 MHz.
  • To ensure proper biasing, connect the VCC pin to a stable voltage source, and decouple it with a 100 nF capacitor to ground. Also, ensure the input signal is within the recommended voltage range.
  • To minimize noise and interference, use a ground plane, keep the input and output traces short and separate, and avoid running signals under the device. Also, use a common ground point for the VCC and input signals.
  • To handle thermal management, ensure good airflow around the device, use a heat sink if necessary, and avoid operating the device near its maximum junction temperature (150°C).
  • To prevent ESD damage, handle the device in an ESD-protected environment, use ESD-protective packaging, and ground yourself before handling the device.

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BFT46 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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