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BGA3131J - NXP

Description: RF Amplifier BGA3131

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PCB Footprints
BGA3131J - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - HVQFN20: plastic thermal enhanced very thin quad flat package; no leads; 20 terminals; body 5 x 5 x 0.85
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3D Models
BGA3131J - NXP  - 3D model - Quad Flat No-Lead - HVQFN20: plastic thermal enhanced very thin quad flat package; no leads; 20 terminals; body 5 x 5 x 0.85
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for BGA3131J
  • Part Number BGA3131J
  • Manufacturer NXP
  • Pin Count 21
  • Part Category Integrated Circuit
  • Package Category Quad Flat No-Lead
  • Footprint Name Quad Flat No-Lead - HVQFN20: plastic thermal enhanced very thin quad flat package; no leads; 20 terminals; body 5 x 5 x 0.85
  • Released Date Dec 2, 2021
  • Last Modified Date Mar 7, 2023 4:10 PM UTC
  • Pinout / Pin List Click Here (Member Only)

BGA3131J Details

  • Manufacturer Part Number:

    BGA3131J

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    QFN

  • Pin Count:

    20

  • Manufacturer Package Code:

    SOT662-1

  • Country Of Origin:

    Mainland China, Taiwan

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    1

  • Consumer IC Type:

    CONSUMER CIRCUIT

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Peak Reflow Temperature (Cel):

    260

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Time@Peak Reflow Temperature-Max (s):

    30

BGA3131J Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Ensure that the RF traces are short and direct, and that the decoupling capacitors are placed close to the device.
  • Use a Smith chart or an impedance tuner to optimize the impedance matching. The device has a nominal impedance of 50 ohms, but the optimal impedance may vary depending on the specific application and PCB layout.
  • The maximum power handling capability of the BGA3131J is 31 dBm. However, the actual power handling capability may be limited by the specific application and the PCB layout.
  • Ensure that the device is properly soldered and that the PCB is designed to withstand the operating temperatures and humidity. Apply a conformal coating to protect the device from moisture and contaminants.
  • The BGA3131J has a thermal resistance of 25°C/W. Ensure that the device is mounted on a heat sink or a thermal pad to dissipate heat effectively. The maximum junction temperature is 150°C.

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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