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BGS16GA14E6327XTSA1 - Infineon

Description: IC RF SWITCH SP6T 3.8GHZ ATSLP14

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BGS16GA14E6327XTSA1 - Infineon  - 3D model
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BGS16GA14E6327XTSA1 Details

  • Manufacturer Part Number:

    BGS16GA14E6327XTSA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    ATSLP-14

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • JESD-30 Code:

    S-PBCC-N14

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    0.65 mm

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    TELECOM CIRCUIT

  • Temperature Grade:

    OTHER

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Width:

    2 mm

BGS16GA14E6327XTSA1 Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal performance involves using a 4-layer PCB with a solid ground plane, placing the device close to the antenna, and using a 50-ohm microstrip line to connect the device to the antenna. Additionally, it's recommended to use a common mode filter to reduce EMI.
  • To ensure the device is properly biased, make sure to connect the VCC pin to a stable 1.8V power supply, and the VDD pin to a stable 3.3V power supply. Also, ensure that the voltage supply is decoupled with a 10uF capacitor and a 100nF capacitor in parallel.
  • The maximum operating temperature range for the BGS16GA14E6327XTSA1 is -40°C to 125°C. However, it's recommended to operate the device within a temperature range of -20°C to 85°C for optimal performance and reliability.
  • To troubleshoot issues with the device's RF performance, start by checking the PCB layout and ensuring that the device is properly biased. Then, use a spectrum analyzer to measure the device's output power and frequency. If issues persist, check the device's input and output impedance matching, and ensure that the device is properly connected to the antenna.
  • The recommended storage condition for the BGS16GA14E6327XTSA1 is to store the device in a dry, cool place with a temperature range of -20°C to 30°C and relative humidity below 60%. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures.

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BGS16GA14E6327XTSA1 Overview

Use the download button to access the BGS16GA14E6327XTSA1 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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