SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Seated Height-Max:
1.1 mm
Supply Current-Max (Isup):
1 mA
Supply Voltage-Max (Vsup):
6.45 V
Supply Voltage-Min (Vsup):
4.45 V
Supply Voltage-Nom (Vsup):
5 V
Surface Mount:
YES
Temperature Grade:
OTHER
Terminal Finish:
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
Terminal Form:
GULL WING
Terminal Pitch:
0.5 mm
Terminal Position:
DUAL
Threshold Voltage-Nom:
+6.65V
Time@Peak Reflow Temperature-Max (s):
30
Width:
3 mm
BQ24095DGQT Frequently Asked Questions (FAQs)
A good PCB layout for the BQ24095DGQT involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the traces between the device and the capacitors. TI provides a recommended PCB layout in the datasheet and application notes.
The selection of external components such as capacitors, resistors, and inductors depends on the specific application requirements. TI provides guidelines for component selection in the datasheet and application notes. Additionally, TI's WEBENCH online design tool can be used to select components and simulate the design.
The BQ24095DGQT has a thermal pad that must be connected to a solid ground plane to ensure proper heat dissipation. The device can operate up to 105°C, but the junction temperature should be kept below 125°C to ensure reliability. A thermal analysis should be performed to ensure the device operates within the recommended temperature range.
Troubleshooting the BQ24095DGQT involves checking the input voltage, output voltage, and current. Verify that the device is properly configured and that the external components are correctly selected. Use an oscilloscope to check the voltage and current waveforms. TI's application notes and technical support resources can also be consulted for troubleshooting guidance.
The BQ24095DGQT is designed to meet CISPR 22 Class B EMI standards. To minimize EMI, use a shielded inductor, keep the layout compact, and use a common-mode choke. Additionally, follow good PCB design practices such as using a solid ground plane, minimizing trace lengths, and using EMI filters if necessary.
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BQ24095DGQT Overview
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
