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BQ24202DGNR - Texas Instruments

Description: 500-mA, 4.2-V Li-Ion Charger for Current-Limited App. w/Charge Status in MSOP-8

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BQ24202DGNR - Texas Instruments - PCB symbol
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PCB Footprints
BQ24202DGNR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGN (S-PDSO-G8)(1)
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BQ24202DGNR - Texas Instruments - 3D model - Small Outline Packages - DGN (S-PDSO-G8)(1)
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BQ24202DGNR Details

  • Manufacturer Part Number:

    BQ24202DGNR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    OPTIONAL TEMPERATURE MONITORING BEFORE AND DURING CHARGE

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    INTEGRATED POWER MANAGEMENT UNIT

  • Input Voltage-Max:

    13.5 V

  • Input Voltage-Min:

    2.8 V

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.07 mm

  • Supply Voltage-Max (Vsup):

    13.5 V

  • Supply Voltage-Min (Vsup):

    2.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

BQ24202DGNR Frequently Asked Questions (FAQs)

  • A good PCB layout for the BQ24202DGNR involves placing the IC close to the battery, using a solid ground plane, and keeping the high-current paths short and wide. TI provides a recommended layout in the datasheet and application notes.
  • TI provides a component selection guide in the datasheet and application notes. The selection of external components depends on the specific application requirements, such as input voltage, output voltage, and maximum current. TI also offers online tools and calculators to help with component selection.
  • The BQ24202DGNR has a thermal shutdown feature to prevent overheating. To ensure reliable operation, ensure good airflow, use a heat sink if necessary, and follow TI's thermal design guidelines. The datasheet provides thermal resistance and junction-to-ambient thermal resistance values to help with thermal design.
  • The BQ24202DGNR has built-in OVP and UVP features. To implement these features, connect the OVP and UVP pins to the desired voltage threshold using resistive dividers. The datasheet provides more information on how to set the voltage thresholds and response times.
  • Yes, the BQ24202DGNR is qualified for automotive and high-reliability applications. It meets the requirements of AEC-Q100 and is PPAP capable. TI also provides a detailed report on the device's reliability and qualification.

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BQ24202DGNR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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