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BQ25172DSGR - Texas Instruments

Description: Battery Management 0.8-A, one- to six-cell NiMH stand-alone linear charger in a QFN package

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PCB Footprints
BQ25172DSGR - Texas Instruments PCB footprint - Small Outline No-lead - Small Outline No-lead - DSG0008A  _ 2021
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3D Models
BQ25172DSGR - Texas Instruments  - 3D model - Small Outline No-lead - DSG0008A  _ 2021
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BQ25172DSGR Details

  • Manufacturer Part Number:

    BQ25172DSGR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HVSON, SOLCC8,.08,20

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    LINEAR BATTERY CHARGER

  • Input Voltage-Max:

    18 V

  • Input Voltage-Min:

    3 V

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.08,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +1.33V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

BQ25172DSGR Frequently Asked Questions (FAQs)

  • A good PCB layout for the BQ25172DSGR involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the traces between the device and the capacitors. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure proper power-up and configuration, follow the recommended power-up sequence: VCC, EN, and then VIN. Also, make sure to configure the device according to the datasheet, including setting the correct voltage regulator output voltage and enabling/disabling the device as needed.
  • The BQ25172DSGR has a thermal pad that must be connected to a solid ground plane to ensure proper heat dissipation. A thermal via or a thermal pad connected to a heat sink can also be used to improve heat dissipation. Additionally, ensure good airflow around the device and avoid blocking the airflow.
  • To troubleshoot issues with the BQ25172DSGR, start by checking the input voltage, output voltage, and enable pin. Verify that the device is properly configured and powered up. Use an oscilloscope to check for voltage drops, noise, or oscillations. Also, check for any signs of overheating or physical damage.
  • The BQ25172DSGR is a commercial-grade device and may not be suitable for high-reliability or safety-critical applications. For such applications, consider using a device with a higher reliability rating, such as automotive or industrial-grade devices. Additionally, ensure that the device is properly qualified and tested for the specific application.

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BQ25172DSGR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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