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BQ500110RGZT - Texas Instruments

Description: https://www.ti.com/lit/ds/symlink/bq500110.pdf?HQS=dis-dk-null-digikeymode-dsf-pf-null-wwe&ts=1631517040405&ref_url=https%253A%252F%252Fwww.digikey.at%252F

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PCB Footprints
BQ500110RGZT - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RGZ0048A
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3D Models
BQ500110RGZT - Texas Instruments  - 3D model - Quad Flat No-Lead - RGZ0048A
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BQ500110RGZT Details

  • Manufacturer Part Number:

    BQ500110RGZT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    QFN

  • Pin Count:

    48

  • Country Of Origin:

    Malaysia, Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.50

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    3.9

  • Consumer IC Type:

    REMOTE CONTROL TRANSMITTER IC

  • JESD-30 Code:

    S-PQCC-N48

  • JESD-609 Code:

    e4

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    110 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC48(UNSPEC)

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.5 mm

  • Supply Current-Max:

    65 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmission Media:

    RF

  • Width:

    7 mm

BQ500110RGZT Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good PCB design practices, such as keeping the power traces short and wide, using a solid ground plane, and placing decoupling capacitors close to the device.
  • To ensure reliable wireless power transfer, ensure the transmitter and receiver coils are properly aligned, the coils are designed for optimal efficiency, and the system is designed to handle variations in load and environmental conditions.
  • The maximum operating temperature range for the BQ500110RGZT is -40°C to 125°C, but it's essential to consider the thermal design and heat dissipation to ensure reliable operation within this range.
  • The BQ500110RGZT has built-in FOD detection, but it requires proper implementation of the FOD pin and associated circuitry. Refer to the datasheet and application notes for guidance on implementing FOD detection.
  • To ensure EMI and EMC compliance, follow good design practices, such as using shielding, filtering, and proper layout techniques. Additionally, consider the system's operating frequency, power levels, and proximity to other devices.

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BQ500110RGZT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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