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BQ500511RHAR - Texas Instruments

Description: Wireless Charging ICs Wireless Power Transmitter Controller 40-VQFN -40 to 85

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BQ500511RHAR - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - Rha (s-pvqfn-n40)
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3D Models
BQ500511RHAR - Texas Instruments  - 3D model - Quad Flat No-Lead - Rha (s-pvqfn-n40)
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BQ500511RHAR Details

  • Manufacturer Part Number:

    BQ500511RHAR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.50

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    3.9

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LINEAR BATTERY CHARGER

  • JESD-30 Code:

    S-PQCC-N40

  • JESD-609 Code:

    e4

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6 mm

BQ500511RHAR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the high-current paths short and wide, and use thermal vias to dissipate heat.
  • Use a heat sink with a thermal interface material, and ensure good airflow around the device. The thermal pad should be connected to a solid ground plane to dissipate heat efficiently.
  • A low-ESR ceramic capacitor (e.g., X5R or X7R) with a value of 10-22 μF is recommended, depending on the input voltage and current requirements.
  • Use the FB pin to set the output voltage. Connect a resistive divider from the output to the FB pin, and calculate the resistor values based on the desired output voltage and the internal reference voltage (0.8 V).
  • The maximum input voltage is 60 V, but it's recommended to operate within 40 V to ensure reliable operation and minimize stress on the device.

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BQ500511RHAR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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