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BQ51051BRHLR - Texas Instruments

Description: bq5105xB High-Efficiency Qi v1.1-Compliant Wireless Power Receiver and Battery Charger 4.50mm x 3.50mm

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BQ51051BRHLR - Texas Instruments - PCB symbol
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PCB Footprints
BQ51051BRHLR - Texas Instruments PCB footprint - Other - Other - RHL0020A_3
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3D Models
BQ51051BRHLR - Texas Instruments - 3D model - Other - RHL0020A_3
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BQ51051BRHLR Details

  • Manufacturer Part Number:

    BQ51051BRHLR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    LINEAR BATTERY CHARGER

  • JESD-30 Code:

    R-PQCC-N20

  • JESD-609 Code:

    e4

  • Length:

    4.5 mm

  • Moisture Sensitivity Level:

    2

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    125 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC20/24,.14X.18,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Current-Max (Isup):

    10 mA

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Threshold Voltage-Nom:

    +15V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.5 mm

BQ51051BRHLR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate layer for the high-frequency signals is recommended. The layout should also minimize the loop area of the power traces to reduce EMI.
  • The device should be mounted on a heat sink with a thermal conductivity of at least 1 W/m-K. The heat sink should be connected to a solid ground plane to ensure good thermal conduction.
  • A 10uF to 22uF X7R or X5R ceramic capacitor is recommended for the input capacitor. The capacitor should be placed as close to the VIN pin as possible.
  • The output filter should be designed to minimize the output voltage ripple. A 10uF to 22uF output capacitor with a 1uH to 2.2uH output inductor is recommended. The output filter should be placed as close to the output pin as possible.
  • The high-frequency components such as the input capacitor, output capacitor, and inductor should be placed as close to the device as possible. The layout should also minimize the loop area of the high-frequency signals to reduce EMI.

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BQ51051BRHLR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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