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BQ78350DBTR-R1 - Texas Instruments

Description: CEDV Li-Ion Gas Gauge and Battery Management Controller

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BQ78350DBTR-R1 - Texas Instruments - PCB symbol
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BQ78350DBTR-R1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DBT (R-PDSO-G30)
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BQ78350DBTR-R1 - Texas Instruments - 3D model - Small Outline Packages - DBT (R-PDSO-G30)
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BQ78350DBTR-R1 Details

  • Manufacturer Part Number:

    BQ78350DBTR-R1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    3.9

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    BATTERY GAUGE

  • JESD-30 Code:

    R-PDSO-G30

  • JESD-609 Code:

    e4

  • Length:

    7.8 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    30

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP30,.25,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    2.6 V

  • Supply Voltage-Min (Vsup):

    2.4 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

BQ78350DBTR-R1 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the high-current paths short and wide, and use thermal vias to dissipate heat.
  • Use the TI-provided software tools, such as the Battery Management Studio, to configure the device for your specific battery chemistry. Consult the user guide for the software tool for more information.
  • The device has a thermal pad on the bottom, so ensure good thermal contact with the PCB. Use thermal vias and a heat sink if necessary. Keep the device away from heat sources and ensure good airflow.
  • Use the built-in diagnostic features, such as the fault registers and the debug interface, to identify the issue. Consult the datasheet and application notes for troubleshooting guidelines.
  • While the device is optimized for certain battery chemistries, it can be used with other chemistries with proper configuration and calibration. Consult with TI support or a qualified engineer for guidance.

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BQ78350DBTR-R1 Overview

Use the download button to access the BQ78350DBTR-R1 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like BQ783, or try a keyword search, such as Power Management Circuits

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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