FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel):
260
Screening Level:
AEC-Q100
Seated Height-Max:
1.2 mm
Supply Voltage-Max (Vsup):
80 V
Surface Mount:
YES
Temperature Grade:
AUTOMOTIVE
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form:
GULL WING
Terminal Pitch:
0.5 mm
Terminal Position:
QUAD
Time@Peak Reflow Temperature-Max (s):
30
Width:
10 mm
BQ79656PAPRQ1 Frequently Asked Questions (FAQs)
A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the high-frequency components (e.g., capacitors, inductors) close to the IC, and use short, wide traces to minimize inductance and resistance.
Consult the BQ79656PAPRQ1 datasheet and application notes for configuration guidelines. Consider factors like battery chemistry, cell count, and balancing requirements. TI also offers a BQ79656PAPRQ1 evaluation module and software development kit to aid in configuration and testing.
The BQ79656PAPRQ1 has a maximum junction temperature of 150°C. Ensure good airflow, use thermal pads or heat sinks if necessary, and consider thermal interface materials to reduce thermal resistance. Monitor the device's temperature and adjust the system design accordingly to prevent overheating.
Consult the datasheet and application notes for troubleshooting guidelines. Use oscilloscopes and logic analyzers to monitor signals and identify issues. Check for proper PCB layout, component selection, and firmware configuration. TI also offers technical support and a community forum for additional assistance.
Yes, the BQ79656PAPRQ1 requires firmware development to configure and control the device. Use TI's software development kit (SDK) and code examples as a starting point. Consider factors like interrupt handling, timing, and data processing when developing firmware for the BQ79656PAPRQ1.
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BQ79656PAPRQ1 Overview
Use the download button to access the BQ79656PAPRQ1 schematic symbol, PCB footprint, and 3D model.
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
