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BSC042NE7NS3GATMA1 - Infineon

Description: MOSFET N-Ch 75V 100A TDSON-8 OptiMOS 3

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PCB Footprints
BSC042NE7NS3GATMA1 - Infineon PCB footprint - Other - Other - PG-TDSON-8_2020
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3D Models
BSC042NE7NS3GATMA1 - Infineon  - 3D model - Other - PG-TDSON-8_2020
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BSC042NE7NS3GATMA1 Details

  • Manufacturer Part Number:

    BSC042NE7NS3GATMA1

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TDSON, SOP-8

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    220 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    75 V

  • Drain Current-Max (ID):

    132 A

  • Drain-source On Resistance-Max:

    0.0042 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    40 pF

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    125 W

  • Pulsed Drain Current-Max (IDM):

    528 A

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-61249-2-21; IEC-68-1

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BSC042NE7NS3GATMA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a PCB layout with a large copper area connected to the thermal pad to ensure good heat dissipation. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation at high temperatures, it is essential to follow the recommended thermal design guidelines, including proper heat sinking, and to operate the device within the specified temperature range.
  • The BSC042NE7NS3GATMA1 has built-in ESD protection, but it is still recommended to follow standard ESD handling precautions when handling the device to prevent damage.
  • Yes, the BSC042NE7NS3GATMA1 is AEC-Q101 qualified, making it suitable for use in automotive applications.
  • Infineon recommends following the JEDEC J-STD-020D.1 standard for soldering profile, with a peak temperature of 260°C and a dwell time of 30-45 seconds.

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BSC042NE7NS3GATMA1 Overview

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