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BSC080N03LSG - Infineon

Description: MOSFET N-Ch 30V 100A TDSON-8 OptiMOS 3

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BSC080N03LSG - Infineon PCB footprint - Other - Other - BSC080N03LSG-1
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BSC080N03LSG - Infineon  - 3D model - Other - BSC080N03LSG-1
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BSC080N03LSG Details

  • Manufacturer Part Number:

    BSC080N03LSG

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Additional Feature:

    AVALANCHE RATED, LOGIC LEVEL COMPATIBLE

  • Avalanche Energy Rating (Eas):

    15 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    14 A

  • Drain-source On Resistance-Max:

    0.012 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    34 W

  • Pulsed Drain Current-Max (IDM):

    212 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BSC080N03LSG Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout for the BSC080N03LSG in their application note AN2013-01. It includes guidelines for thermal vias, copper thickness, and pad layout to ensure optimal thermal performance.
  • The selection of the gate resistor depends on the specific application and switching frequency. As a general guideline, Infineon recommends a gate resistor value between 1 ohm and 10 ohm. A higher value can reduce EMI, but may increase switching losses. A lower value can reduce switching losses, but may increase EMI.
  • The maximum allowed junction temperature for the BSC080N03LSG is 150°C. However, it's recommended to keep the junction temperature below 125°C for optimal reliability and performance.
  • Yes, the BSC080N03LSG is suitable for high-frequency switching applications up to 1 MHz. However, it's essential to consider the device's switching losses, gate charge, and parasitic capacitances when designing the application.
  • To ensure the MOSFET is fully turned on and off, it's essential to provide a sufficient gate-source voltage (VGS) and a fast enough switching time. Infineon recommends a VGS of at least 10V for full turn-on and a switching time of less than 100 ns to minimize power losses.

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Part Image BSC080N03LSGATMA1 Infineon Technologies AG

Power Field-Effect Transistor, 14A I(D), 30V, 0.012ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET