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BSC084P03NS3GATMA1 - Infineon

Description: MOSFET P-Ch -30V -78.6A TDSON-8 OptiMOS P3

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BSC084P03NS3GATMA1 - Infineon PCB footprint - Other - Other - PG-TDSON-8-5_ffw
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BSC084P03NS3GATMA1 - Infineon  - 3D model - Other - PG-TDSON-8-5_ffw
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BSC084P03NS3GATMA1 Details

  • Manufacturer Part Number:

    BSC084P03NS3GATMA1

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TDSON-8

  • Pin Count:

    8

  • Country Of Origin:

    Austria, Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    5

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    105 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    14.9 A

  • Drain-source On Resistance-Max:

    0.0084 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    160 pF

  • JESD-30 Code:

    R-PDSO-N8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    69 W

  • Pulsed Drain Current-Max (IDM):

    200 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    62.2 ns

  • Turn-on Time-Max (ton):

    224.9 ns

BSC084P03NS3GATMA1 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the BSC084P03NS3GATMA1 is a 3-pin TO-220 package with a minimum pad size of 2.5mm x 2.5mm and a thermal pad size of 3.5mm x 3.5mm.
  • To ensure proper cooling, a heat sink with a thermal resistance of less than 10°C/W is recommended. Additionally, a thermal interface material (TIM) with a thermal conductivity of at least 1 W/mK should be used to fill the gap between the device and the heat sink.
  • The maximum allowed voltage on the gate pin is 20V, but it's recommended to keep it below 15V to ensure reliable operation and prevent damage to the device.
  • Yes, the BSC084P03NS3GATMA1 is suitable for high-frequency switching applications up to 100 kHz. However, it's essential to ensure that the device is properly cooled and the PCB layout is optimized for high-frequency operation.
  • To protect the BSC084P03NS3GATMA1 from overvoltage and overcurrent, it's recommended to use a voltage clamp circuit and a current sense resistor in series with the device. Additionally, a fuse or a circuit breaker can be used to protect against overcurrent conditions.

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BSC084P03NS3GATMA1 Overview

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