- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for BSC0911ND
- Part Number BSC0911ND
- Manufacturer Infineon
- Pin Count 11
- Part Category MOSFET (N-Channel)
- Package Category Other
- Footprint Name Other - PG-TISON_ffw
- Released Date Feb 7, 2019
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
BSC0911ND Details
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Manufacturer Part Number:
BSC0911ND
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Pbfree Code:
No
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Country Of Origin:
Austria, Malaysia
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ECCN Code:
EAR99
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Manufacturer:
Infineon Technologies AG
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YTEOL:
7
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Case Connection:
DRAIN SOURCE
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Configuration:
SERIES, 2 ELEMENTS WITH BUILT-IN DIODE
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DS Breakdown Voltage-Min:
25 V
BSC0911ND Frequently Asked Questions (FAQs)
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Infineon recommends a PCB layout with a large copper area connected to the drain pin (pin 3) to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended, and the copper area should be connected to a heat sink or a thermal pad.
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To ensure proper biasing, the gate-source voltage (Vgs) should be between 4.5V and 10V, and the drain-source voltage (Vds) should be between 10V and 30V. Additionally, the gate current (Ig) should be limited to 10mA to prevent damage to the device.
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The maximum allowed power dissipation of the BSC0911ND is 30W. However, this value can be derated based on the ambient temperature and the thermal resistance of the device. Refer to the datasheet for more information on thermal derating.
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Yes, the BSC0911ND is suitable for high-frequency switching applications up to 1 MHz. However, the device's switching characteristics, such as rise and fall times, should be considered to ensure optimal performance.
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To protect the BSC0911ND from ESD, handle the device with an anti-static wrist strap or mat, and ensure that the PCB is designed with ESD protection in mind, such as using ESD protection diodes or resistors.
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BSC0911ND Overview
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