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BSC112N06LDATMA1 - Infineon

Description: MOSFET TRENCH 40<-<100V

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PCB Footprints
BSC112N06LDATMA1 - Infineon PCB footprint - Other - Other - PG-TDSON-8-4_1
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BSC112N06LDATMA1 - Infineon  - 3D model - Other - PG-TDSON-8-4_1
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BSC112N06LDATMA1 Details

  • Manufacturer Part Number:

    BSC112N06LDATMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    80 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    57 A

  • Drain-source On Resistance-Max:

    0.0112 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    56 pF

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    65 W

  • Pulsed Drain Current-Max (IDM):

    228 A

  • Reference Standard:

    IEC-61249-2-21

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BSC112N06LDATMA1 Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in their application note AN2013-03, which includes guidelines for thermal vias, copper thickness, and heat sink design to ensure optimal thermal performance.
  • The gate resistor value depends on the specific application requirements, such as switching frequency, voltage, and current. A general guideline is to use a value between 1 ohm and 10 ohm. Consult Infineon's application notes and simulation tools to determine the optimal value for your design.
  • The maximum allowed voltage during startup or shutdown is specified in the datasheet as VCC(max) = 30V. However, it's recommended to limit the voltage to 25V to ensure reliable operation and prevent damage to the device.
  • The BSC112N06LDATMA1 is rated for operation up to 150°C (TJ). However, the device's performance and reliability may degrade at high temperatures. Consult Infineon's thermal modeling tools and application notes to determine the device's suitability for your specific high-temperature application.
  • To ensure EMC, follow Infineon's guidelines for PCB layout, component selection, and shielding. Additionally, consider using a common-mode choke and a snubber circuit to reduce electromagnetic interference (EMI). Consult Infineon's application notes and EMC simulation tools for more information.

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