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BSL211SPH6327XTSA1 - Infineon

Description: MOSFETs SMALL SIGNAL+P-CH

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BSL211SPH6327XTSA1 - Infineon - PCB symbol
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PCB Footprints
BSL211SPH6327XTSA1 - Infineon PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - PG-TSOP6-6_2024
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3D Models
BSL211SPH6327XTSA1 - Infineon - 3D model - SOT23 (6-Pin) - PG-TSOP6-6_2024
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BSL211SPH6327XTSA1 Details

  • Manufacturer Part Number:

    BSL211SPH6327XTSA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Austria, Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    5

  • Additional Feature:

    AVALANCHE RATED, LOGIC LEVEL COMPATIBLE

  • Avalanche Energy Rating (Eas):

    26 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    4.7 A

  • Drain-source On Resistance-Max:

    0.067 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    P-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    18.8 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BSL211SPH6327XTSA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a 2-layer or 4-layer PCB with a thermal via array under the device to ensure optimal thermal performance. A minimum of 10 thermal vias with a diameter of 0.3 mm to 0.5 mm is recommended.
  • To ensure EMC, Infineon recommends following the guidelines in the application note AN2013-01, which provides information on PCB layout, component placement, and shielding. Additionally, the device should be placed at least 10 mm away from any metal objects or cables.
  • The maximum allowed voltage on the input pins is 5.5 V. Exceeding this voltage may damage the device. It is recommended to use a voltage limiter or a voltage regulator to ensure the input voltage remains within the specified range.
  • The device should be stored in a dry, cool place away from direct sunlight. It should be handled with anti-static precautions, such as using an anti-static wrist strap or mat. The device should not be exposed to temperatures above 40°C or humidity above 60% during storage and shipping.
  • Infineon recommends a soldering profile with a peak temperature of 260°C for a maximum of 10 seconds. The device should be soldered using a soldering iron with a temperature range of 220°C to 240°C.

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BSL211SPH6327XTSA1 Overview

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