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BSL215CH6327XTSA1 - Infineon

Description: MOSFET SMALL SIGNAL+P-CH OptiMOS2 + OptiMOS-P 2 Small Signal Transistor

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PCB Footprints
BSL215CH6327XTSA1 - Infineon PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - TSOP-6 (1)
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3D Models
BSL215CH6327XTSA1 - Infineon  - 3D model - SOT23 (6-Pin) - TSOP-6 (1)
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BSL215CH6327XTSA1 Details

  • Manufacturer Part Number:

    BSL215CH6327XTSA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Austria, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.21.00.95

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    7

  • Additional Feature:

    AVALANCHE RATED

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    1.5 A

  • Drain-source On Resistance-Max:

    0.14 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    9 pF

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL AND P-CHANNEL

  • Power Dissipation Ambient-Max:

    0.5 W

  • Power Dissipation-Max (Abs):

    0.5 W

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BSL215CH6327XTSA1 Frequently Asked Questions (FAQs)

  • Infineon provides a reference design guide for PCB layout and thermal management. It's essential to follow the recommended layout and thermal design to ensure optimal performance, reliability, and thermal dissipation. Consult the Infineon application note AN2013-01 for more information.
  • To ensure EMC and reduce EMI, follow the guidelines in the Infineon application note AN2013-01. Implement proper PCB layout, use shielding, and consider adding EMI filters or common-mode chokes as needed. Additionally, consult the IEC 61967 standard for EMC in industrial environments.
  • Infineon provides reliability data and lifespan expectations in the datasheet and application notes. However, for specific operating conditions, consult with Infineon's technical support or refer to the device's reliability report. Factors like temperature, voltage, and current stress affect the device's lifespan.
  • For troubleshooting, refer to the Infineon application notes and datasheet. Use oscilloscopes and logic analyzers to debug issues. Consult Infineon's technical support or online forums for guidance on specific issues. Additionally, consider using simulation tools like LTspice or PSpice to model and simulate the circuit.
  • Operating the device beyond recommended specifications can lead to reduced performance, reliability, and lifespan. It may also void the warranty. Consult the datasheet and application notes for recommended operating conditions, and avoid exceeding maximum ratings to ensure optimal performance and reliability.

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BSL215CH6327XTSA1 Overview

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