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BSL308PEH6327XTSA1 - Infineon

Description: BSL308PEH6327XTSA1 Dual P-Channel MOSFET, 2 A, 30 V OptiMOS P, 6-Pin TSOP Infineon

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BSL308PEH6327XTSA1 - Infineon - PCB symbol
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PCB Footprints
BSL308PEH6327XTSA1 - Infineon PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - TSOP-6_1
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3D Models
BSL308PEH6327XTSA1 - Infineon - 3D model - SOT23 (6-Pin) - TSOP-6_1
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BSL308PEH6327XTSA1 Details

  • Manufacturer Part Number:

    BSL308PEH6327XTSA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSOP-6

  • Country Of Origin:

    Austria, Malaysia

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    7

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    2 A

  • Drain-source On Resistance-Max:

    0.08 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    18 pF

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    P-CHANNEL

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Element Material:

    SILICON

BSL308PEH6327XTSA1 Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in their application note AN2013-01, which includes guidelines for thermal vias, copper thickness, and component placement to ensure optimal thermal performance.
  • Infineon provides EMC guidelines in their application note AN2013-02, which includes recommendations for PCB layout, component selection, and shielding to minimize electromagnetic interference.
  • According to Infineon's application note AN2013-03, the maximum allowed voltage transient on the input pins is 10% above the recommended operating voltage, but not exceeding 40V.
  • Infineon recommends using an external current sense resistor and a comparator to detect overcurrent conditions. The application note AN2013-04 provides a detailed design example.
  • Infineon provides a recommended soldering profile in their application note AN2013-05, which includes guidelines for temperature, time, and soldering techniques to ensure reliable assembly.

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BSL308PEH6327XTSA1 Overview

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