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BSL316CH6327XTSA1 - Infineon

Description: MOSFET SMALL SIGNAL+P/N-CH OptiMOS 2 + OptiMOS-P 2 Small Signal Transistor

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BSL316CH6327XTSA1 - Infineon - PCB symbol
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PCB Footprints
BSL316CH6327XTSA1 - Infineon PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - TSOP-6 (1)+
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3D Models
BSL316CH6327XTSA1 - Infineon - 3D model - SOT23 (6-Pin) - TSOP-6 (1)+
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BSL316CH6327XTSA1 Details

  • Manufacturer Part Number:

    BSL316CH6327XTSA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Austria, Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    7

  • Additional Feature:

    AVALANCHE RATED

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    1.4 A

  • Drain-source On Resistance-Max:

    0.16 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    7 pF

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL AND P-CHANNEL

  • Power Dissipation-Max (Abs):

    0.5 W

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Element Material:

    SILICON

BSL316CH6327XTSA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a 2-layer or 4-layer PCB with a thermal via array under the device to ensure good thermal conductivity. A minimum of 5 thermal vias with a diameter of 0.3 mm is recommended.
  • Infineon recommends using a soldering profile with a peak temperature of 260°C and a dwell time of 30-60 seconds. The device should be soldered using a no-clean flux and a solder alloy with a melting point above 217°C.
  • The recommended operating voltage range for BSL316CH6327XTSA1 is 12 V to 14 V. Operating the device outside of this range may affect its performance and reliability.
  • Infineon recommends using a voltage supervisor or a power-on reset circuit to protect the device from overvoltage and undervoltage conditions. A voltage clamp or a transient voltage suppressor can also be used to protect the device from voltage spikes.
  • The maximum allowed current for BSL316CH6327XTSA1 is 30 A. Exceeding this current may cause the device to overheat or fail.

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BSL316CH6327XTSA1 Overview

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