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BSM30GP60 - Infineon

Description: IGBT Modules 600V 30A PIM

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PCB Footprints
BSM30GP60 - Infineon PCB footprint - Other - Other - BSM30GP60-2
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BSM30GP60 - Infineon  - 3D model - Other - BSM30GP60-2
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BSM30GP60 Details

  • Manufacturer Part Number:

    BSM30GP60

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    MODULE

  • Pin Count:

    24

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Case Connection:

    ISOLATED

  • Collector Current-Max (IC):

    70 A

  • Collector-Emitter Voltage-Max:

    600 V

  • Configuration:

    COMPLEX

  • Gate-Emitter Voltage-Max:

    20 V

  • JESD-30 Code:

    R-XUFM-X24

  • Number of Elements:

    7

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    280 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Form:

    UNSPECIFIED

  • Terminal Position:

    UPPER

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    POWER CONTROL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Nom (toff):

    315 ns

  • Turn-on Time-Nom (ton):

    105 ns

  • VCEsat-Max:

    2.45 V

BSM30GP60 Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the BSM30GP60 is 20 kHz, but it can be used up to 50 kHz with some limitations.
  • Proper thermal management can be achieved by ensuring good heat sink contact, using a thermal interface material, and maintaining a maximum junction temperature of 150°C.
  • The recommended gate resistor value is between 10 ohms and 20 ohms, depending on the specific application and switching frequency.
  • Yes, the BSM30GP60 can be used in a parallel configuration, but it requires careful consideration of the current sharing and thermal management between the modules.
  • The maximum allowable voltage imbalance between the DC links is ±10% of the nominal voltage to ensure proper operation and prevent damage to the module.

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