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BSP170PH6327XTSA1 - Infineon

Description: MOSFET P-Ch -60V -1.9A SOT-223-3

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PCB Footprints
BSP170PH6327XTSA1 - Infineon PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - SOT-223
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3D Models
BSP170PH6327XTSA1 - Infineon  - 3D model - SOT223 (3-Pin) - SOT-223
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BSP170PH6327XTSA1 Details

  • Manufacturer Part Number:

    BSP170PH6327XTSA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    4

  • Country Of Origin:

    Austria, Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    5

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    70 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    1.9 A

  • Drain-source On Resistance-Max:

    0.3 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    1.8 W

  • Pulsed Drain Current-Max (IDM):

    7.6 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Transistor Element Material:

    SILICON

BSP170PH6327XTSA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure proper thermal management, use a heat sink if necessary, and follow the recommended operating conditions. Also, consider using a thermistor or thermocouple to monitor the device temperature.
  • The maximum allowed voltage on the input pins is the supply voltage (VCC) + 0.3V. Exceeding this voltage may damage the device.
  • Follow standard ESD handling procedures, use ESD-protective packaging, and ensure that all personnel handling the device are grounded. Use an ESD wrist strap or mat if necessary.
  • Store the device in a dry, cool place, away from direct sunlight. The recommended storage temperature is between -40°C and 125°C.

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BSP170PH6327XTSA1 Overview

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