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BSP171P - Infineon

Description: Infineon BSP171P P-channel MOSFET Transistor, 1.9 A, 60 V, 4-Pin SOT-223

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PCB Footprints
BSP171P - Infineon PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - SOT-223-4-2020
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3D Models
BSP171P - Infineon  - 3D model - SOT223 (3-Pin) - SOT-223-4-2020
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BSP171P Details

  • Manufacturer Part Number:

    BSP171P

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-223

  • Pin Count:

    4

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    5.4

  • Avalanche Energy Rating (Eas):

    70 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    1.9 A

  • Drain-source On Resistance-Max:

    0.3 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    55 pF

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    1.8 W

  • Pulsed Drain Current-Max (IDM):

    7.6 A

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    AEC-Q101; IEC-61249-2-21; IEC-68-1

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    406 ns

  • Turn-on Time-Max (ton):

    41 ns

BSP171P Frequently Asked Questions (FAQs)

  • Infineon recommends a PCB layout with a large copper area connected to the drain pin (pin 3) to dissipate heat efficiently. A thermal via array under the device can also improve thermal performance.
  • The BSP171P requires a bias voltage of 5V to 12V on the gate pin (pin 1) to ensure proper operation. A voltage regulator or a zener diode can be used to regulate the bias voltage.
  • The maximum allowed power dissipation of the BSP171P is 2.5W. Exceeding this limit can lead to device failure. Ensure proper heat sinking and thermal management to stay within the allowed power dissipation.
  • Yes, the BSP171P can be used in switching applications. However, ensure that the switching frequency is within the recommended range (up to 100 kHz) and that the device is properly biased and heat-sunk to prevent overheating.
  • Handle the BSP171P with care to prevent ESD damage. Use an anti-static wrist strap or mat, and ensure that the device is stored in an anti-static package. Avoid touching the device's pins or leads to prevent ESD damage.

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