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BSP230,135 - Nexperia

Description: Nexperia BSP230,135 P-channel MOSFET, 210 mA, 300 V, 3+Tab-Pin SOT-223

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BSP230,135 Details

  • Manufacturer Part Number:

    BSP230,135

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SC-73

  • Pin Count:

    4

  • Manufacturer Package Code:

    SOT223

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    111 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    0

  • Additional Feature:

    LOGIC LEVEL COMPATIBLE

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    300 V

  • Drain Current-Max (ID):

    0.21 A

  • Drain-source On Resistance-Max:

    17 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    15 pF

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Reference Standard:

    IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BSP230,135 Frequently Asked Questions (FAQs)

  • A good PCB layout for the BSP230,135 involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure proper biasing, connect the input pins (VIN) to a stable voltage source, and decouple the input with a capacitor (e.g., 100nF). The output pins (VOUT) should be connected to a load, and decoupled with another capacitor (e.g., 100nF).
  • The maximum allowed power dissipation for the BSP230,135 is 1.5W. Exceeding this limit can cause the device to overheat, leading to reduced performance or even damage.
  • The BSP230,135 is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's essential to ensure proper cooling and thermal management to maintain optimal performance.
  • To protect the BSP230,135, use overvoltage protection (OVP) and overcurrent protection (OCP) circuits. OVP can be achieved with a voltage clamp or a zener diode, while OCP can be implemented using a current sense resistor and a comparator.

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BSP230,135 Overview

Use the download button to access the BSP230,135 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like BSP23, or try a keyword search, such as Small Signal Field-Effect Transistors

About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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