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BSP295H6327XTSA1 - Infineon

Description: Trans MOSFET N-CH 60V 1.8A Automotive 4-Pin(3+Tab) SOT-223 T/R

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Symbol
BSP295H6327XTSA1 - Infineon - PCB symbol
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PCB Footprints
BSP295H6327XTSA1 - Infineon PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - SOT 223
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3D Models
BSP295H6327XTSA1 - Infineon - 3D model - SOT223 (3-Pin) - SOT 223
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BSP295H6327XTSA1 Details

  • Manufacturer Part Number:

    BSP295H6327XTSA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    4

  • Country Of Origin:

    Austria, Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    5

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    1.8 A

  • Drain-source On Resistance-Max:

    0.5 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    7.2 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Transistor Element Material:

    SILICON

BSP295H6327XTSA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently.
  • Follow the recommended operating temperature range (TJ) of -40°C to 150°C, and consider using a heat sink or thermal interface material to maintain a safe junction temperature.
  • Use a shielded cable or a twisted pair for the output stage, and ensure a low-impedance path for the return current. Also, consider adding EMI filters or chokes to the input and output stages.
  • Choose capacitors with a high ripple current rating, low ESR, and a voltage rating that exceeds the maximum input voltage. For the output capacitor, consider a low-ESR ceramic or film capacitor with a suitable voltage rating.
  • Monitor and control the junction temperature, ensure a stable input voltage, and avoid exceeding the maximum current rating. Also, consider using a soft-start circuit to reduce inrush currents during power-up.

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BSP295H6327XTSA1 Overview

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