Please enter a minimum 3 letters or numbers
Technical Content
Part Image

BSP297 - Infineon

Description: INFINEON - BSP297. - Power MOSFET, N Channel, 200 V, 600 mA, 2 ohm, SOT-223, Surface Mount

Download BSP297 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Send part feedback
Symbol
BSP297 - Infineon - PCB symbol
click to zoom
PCB Footprints
BSP297 - Infineon PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - PG-SOT223-4-
click to zoom
3D Models
BSP297 - Infineon - 3D model - SOT223 (3-Pin) - PG-SOT223-4-
click to zoom

BSP297 Details

  • Manufacturer Part Number:

    BSP297

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-223

  • Pin Count:

    4

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    5.95

  • Additional Feature:

    LOGIC LEVEL COMPATIBLE

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    200 V

  • Drain Current-Max (ID):

    0.66 A

  • Drain-source On Resistance-Max:

    1.8 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation Ambient-Max:

    1.8 W

  • Power Dissipation-Max (Abs):

    1.8 W

  • Pulsed Drain Current-Max (IDM):

    2.64 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BSP297 Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in the application note AN191 'Layout Recommendations for Infineon's High Power Devices' which should be followed for optimal performance of the BSP297.
  • Proper cooling of the BSP297 can be achieved by following the thermal design guidelines provided in the datasheet, using a heat sink with a thermal resistance of ≤ 1 K/W, and ensuring good airflow around the device.
  • The maximum allowed voltage transient on the input of the BSP297 is ±100 V, as specified in the datasheet. Exceeding this limit may damage the device.
  • The BSP297 is rated for operation up to 150°C, but the maximum junction temperature (Tj) should not exceed 175°C. Ensure proper cooling and derate the device according to the thermal derating curve in the datasheet for high-temperature operation.
  • Handle the BSP297 with ESD-protective equipment, such as wrist straps and mats, and ensure that the device is properly grounded during assembly and testing. Also, follow the ESD protection guidelines provided in the datasheet.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

BSP297 Overview

Use the download button to access the BSP297 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like BSP29, or try a keyword search, such as Power Field-Effect Transistors

Parts related to BSP297

Showing 0 results

Part Image

← Prev Next →
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader Twitter LinkedIn

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑