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BSP372L6327HTSA1 - Infineon

Description: MOSFET N-CH 100V 1.7A SOT-223

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PCB Footprints
BSP372L6327HTSA1 - Infineon PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - PG-SOT223
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3D Models
BSP372L6327HTSA1 - Infineon  - 3D model - SOT223 (3-Pin) - PG-SOT223
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BSP372L6327HTSA1 Details

  • Manufacturer Part Number:

    BSP372L6327HTSA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    GREEN, PLASTIC PACKAGE-4

  • Pin Count:

    4

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    45 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    1.7 A

  • Drain-source On Resistance-Max:

    0.31 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G4

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    6.8 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Element Material:

    SILICON

BSP372L6327HTSA1 Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in their application note AN2019-01, which includes guidelines for thermal vias, copper thickness, and component placement to minimize thermal resistance.
  • Infineon recommends following the guidelines in their application note AN2019-01 for thermal design and layout. Additionally, ensure that the device is operated within the specified junction temperature (Tj) range of -40°C to 150°C, and consider using a heat sink or thermal interface material if necessary.
  • The maximum allowed voltage for the bootstrap capacitor is typically limited by the voltage rating of the capacitor itself. Infineon recommends using a capacitor with a voltage rating of at least 25V to ensure reliable operation.
  • To troubleshoot OCP issues, check the device's datasheet for the OCP threshold and response time. Verify that the sense resistor is correctly sized and connected. Also, ensure that the device is properly configured and that the OCP feature is not disabled. If issues persist, consult Infineon's application notes or contact their support team.
  • The recommended gate drive voltage for the BSP372L6327HTSA1 is typically between 10V to 15V, depending on the specific application and switching frequency. Consult the device's datasheet and application notes for more information.

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BSP372L6327HTSA1 Overview

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