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BSP372NH6327XTSA1 - Infineon

Description: MOSFET SMALL SIGNAL N-CH

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PCB Footprints
BSP372NH6327XTSA1 - Infineon PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - PG-SOT223-4
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3D Models
BSP372NH6327XTSA1 - Infineon  - 3D model - SOT223 (3-Pin) - PG-SOT223-4
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BSP372NH6327XTSA1 Details

  • Manufacturer Part Number:

    BSP372NH6327XTSA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    GREEN, PLASTIC PACKAGE-4

  • Pin Count:

    4

  • Country Of Origin:

    Austria, Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    33 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    1.8 A

  • Drain-source On Resistance-Max:

    0.23 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    28 pF

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.8 W

  • Pulsed Drain Current-Max (IDM):

    7.2 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Element Material:

    SILICON

BSP372NH6327XTSA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Infineon recommends following the thermal design guidelines, using a heat sink if necessary, and ensuring good airflow around the device. Additionally, consider using a thermal interface material to improve heat transfer.
  • The input capacitor should be a low-ESR ceramic capacitor with a minimum capacitance of 10uF and a voltage rating of at least 25V. X5R or X7R dielectrics are recommended for their stability over temperature.
  • Keep the switching node (SW) as short as possible, use a solid ground plane, and minimize the loop area of the high-frequency currents. Additionally, use a common-mode choke and a shielded cable for the output.
  • Apply the input voltage (VIN) first, then the enable signal (EN). Ensure the input voltage is stable before applying the enable signal.

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BSP372NH6327XTSA1 Overview

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