Infineon recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
Infineon recommends following the thermal design guidelines, using a heat sink if necessary, and ensuring good airflow around the device. Additionally, consider using a thermal interface material to improve heat transfer.
The input capacitor should be a low-ESR ceramic capacitor with a minimum capacitance of 10uF and a voltage rating of at least 25V. X5R or X7R dielectrics are recommended for their stability over temperature.
Keep the switching node (SW) as short as possible, use a solid ground plane, and minimize the loop area of the high-frequency currents. Additionally, use a common-mode choke and a shielded cable for the output.
Apply the input voltage (VIN) first, then the enable signal (EN). Ensure the input voltage is stable before applying the enable signal.
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BSP372NH6327XTSA1 Overview
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