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BSP742T - Infineon

Description: Power Switch ICs - Power Distribution SMART HI SIDE SWITCH .8A

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BSP742T - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-DSO-8-24_2021
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BSP742T - Infineon  - 3D model - Small Outline Packages - PG-DSO-8-24_2021
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BSP742T Details

  • Manufacturer Part Number:

    BSP742T

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SO-8

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    14

  • Built-in Protections:

    TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

  • Driver Number of Bits:

    1

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Output Current Flow Direction:

    SINK

  • Output Current-Max:

    0.8 A

  • Output Peak Current Limit-Nom:

    1.1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.73 mm

  • Supply Voltage-Max:

    34 V

  • Supply Voltage-Min:

    5 V

  • Supply Voltage-Nom:

    13.5 V

  • Surface Mount:

    YES

  • Technology:

    MOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Turn-off Time:

    170 µs

  • Turn-on Time:

    140 µs

  • Width:

    4 mm

BSP742T Frequently Asked Questions (FAQs)

  • Infineon recommends a 4-layer PCB with a solid ground plane, and to keep the high-frequency traces as short as possible. Additionally, a common mode choke can be used to filter out EMI.
  • The BSP742T has a thermal pad on the bottom of the package. Ensure good thermal contact between the thermal pad and a heat sink or a metal plate on the PCB. Apply a thin layer of thermal interface material (TIM) to improve heat transfer.
  • The maximum allowed voltage on the VCC pin is 5.5V. Exceeding this voltage may damage the device.
  • Handle the device by the body, not the pins. Use an ESD wrist strap or mat, and ensure the PCB is designed with ESD protection in mind, such as using ESD diodes or resistors.
  • The BSP742T is designed to operate at frequencies up to 1 GHz. However, the optimal operating frequency range depends on the specific application and PCB design.

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