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BSP762TXUMA1 - Infineon

Description: Infineon BSP762TXUMA1, 1-Channel Intelligent Power Switch, High Side, 2.4A, -10 → 16V 8-Pin, SOIC

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BSP762TXUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-DSO-8-24-1
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BSP762TXUMA1 - Infineon  - 3D model - Small Outline Packages - PG-DSO-8-24-1
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BSP762TXUMA1 Details

  • Manufacturer Part Number:

    BSP762TXUMA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    DSO-8

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6.8

  • Additional Feature:

    ESD Value for IN pin is 1C

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    1.3 mA

  • Supply Voltage-Max (Vsup):

    34 V

  • Supply Voltage-Min (Vsup):

    5 V

  • Supply Voltage-Nom (Vsup):

    13.5 V

  • Surface Mount:

    YES

  • Technology:

    SIPMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    4 mm

BSP762TXUMA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure proper heat sinking, use a thermal interface material (TIM) between the device and heat sink, and follow the recommended PCB layout guidelines. Also, consider using a thermocouple to monitor the device temperature.
  • The maximum allowed voltage on the input pins is 5.5V, exceeding this may cause damage to the device. Ensure that the input voltage is within the recommended operating range.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input lines to protect the device from electrostatic discharge. Follow proper handling and storage procedures to prevent ESD damage.
  • Infineon recommends a soldering profile with a peak temperature of 260°C, a dwell time of 30-60 seconds, and a cooling rate of 4-6°C/s. Ensure that the soldering process is within the recommended specifications to prevent damage to the device.

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