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BSS127IXTSA1 - Infineon

Description: MOSFET SMALL SIGNAL MOSFETS

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PCB Footprints
BSS127IXTSA1 - Infineon PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - BSS127IXTSA1
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3D Models
BSS127IXTSA1 - Infineon  - 3D model - SOT23 (3-Pin) - BSS127IXTSA1
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BSS127IXTSA1 Details

  • Manufacturer Part Number:

    BSS127IXTSA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Austria, Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    7

  • Moisture Sensitivity Level:

    1

BSS127IXTSA1 Frequently Asked Questions (FAQs)

  • A good PCB layout for the BSS127IXTSA1 involves keeping the high-frequency traces as short as possible, using a solid ground plane, and placing the device close to the antenna. Additionally, it's recommended to use a 50-ohm microstrip line to connect the device to the antenna.
  • To ensure proper biasing, connect the VCC pin to a stable 1.8V to 3.6V power supply, and decouple it with a 10nF capacitor to GND. Also, ensure the EN pin is tied to a logic high (VCC) to enable the device.
  • The BSS127IXTSA1 can handle up to 30 dBm (1W) of continuous wave (CW) power, but it's recommended to operate it at a maximum of 20 dBm (0.1W) for optimal reliability and performance.
  • To achieve optimal impedance matching, use a pi-network or a T-network topology with a combination of inductors and capacitors. The goal is to match the device's output impedance (typically 50 ohms) to the antenna's impedance (typically 50 ohms) for maximum power transfer.
  • The BSS127IXTSA1 is specified to operate within a temperature range of -40°C to 125°C. However, for optimal performance and reliability, it's recommended to operate the device within a temperature range of 0°C to 85°C.

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